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Semi-Etched Plates for Complex Manifolding in Printed Circuit Heat Exchangers

Semi-Etched Plates for Complex Manifolding in Printed Circuit Heat Exchangers

Marchio: XHS/ Customized
Numero di modello: Costume
MOQ: 10
prezzo: 80-100USD
Condizioni di pagamento: T/t
Capacità di approvvigionamento: 10000-100000pcs / Week
Informazioni dettagliate
Luogo di origine:
Cina
Certificazione:
ISO 9001, ISO 14001
Materiali:
Acciaio inossidabile, titanio o personalizzato
Spessore:
0,5-3,0 mm
Tolleranza:
+/- 0,005 mm
Processo di produzione:
Attacco chimico foto, placcatura, timbratura, taglio laser
Imballaggi particolari:
PE borse e cartoni / personalizzati
Capacità di alimentazione:
10000-100000pcs / Week
Evidenziare:

semi-etched plates for PCHE

,

complex manifolding heat exchanger plates

,

printed circuit heat exchanger plates

Descrizione del prodotto
Semi-Etched Plates for Complex Manifolding in Printed Circuit Heat Exchangers
Description of Semi-Etched Plates for Printed Circuit Heat Exchangers

What is Printed Circiut Heat Exchangers?

Printed Circuit Board Heat Exchanger (PCHE), also known as Diffusion Bonded Compact Heat Exchanger, represents a new generation of heat exchange equipment combining ultra-compact design with high efficiency. This device utilizes chemical etching technology to precisely fabricate micrometer-to-millimeter-scale flow channels within metal plates. These plates are then integrated into a monolithic module through diffusion bonding, delivering both exceptional resistance to high temperatures and pressures alongside highly efficient heat transfer characteristics.

Semi-Etched Plates for Complex Manifolding in Printed Circuit Heat Exchangers 0
Specifications of Semi-Etched Plates for Printed Circuit Heat Exchangers
Material Stainless Steel 316L, Titanium Aluminum, etc.
Thickness 0.05mm to 3.0mm can be customized
Size Can be customized, Max to 700*1800mm,
General Tolerance ±0.1mm, according to the thickness of the plate
Processing Photochemical machining/ metal etching/ Photo etching
Other Processing Diffusion bonding or other processing as requested
Semi-Etched Plates for Complex Manifolding in Printed Circuit Heat Exchangers 1 Semi-Etched Plates for Complex Manifolding in Printed Circuit Heat Exchangers 2 Semi-Etched Plates for Complex Manifolding in Printed Circuit Heat Exchangers 3

Manufacturing of Semi-Etched Plates for Printed Circuit Heat Exchangers

1.Chemical etching micro channels of compact heat exchanger plates

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2. Diffusion bonded compact heat exchangers plates

We excel in providing comprehensive PCHE solutions, leveraging precision chemical etching and advanced diffusion bonding to deliver heat exchangers of exceptional reliability, efficiency, and consistent performance—even under the most demanding conditions.

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Packing and Shipping of Semi-Etched Plates for Printed Circuit Heat Exchangers

Packing Methods:

We offer multiple packaging options to ensure maximum protection, including protective covers, PE bags, and foam inserts. Customized packaging solutions are also available upon request.

Shipment Methods:

By Air / Sea/ Express: EMS/DHL/FedEx/UPS etc,

How to custom Compact Heat Exchanger Plates from us?
  1. Please send us your design.
    We accept the following file formats:DWG, DXF, PDF, STP, Gerber, IGES, CorelDraw and Adobe Illustrator
  2. Samples making lead time:3-10days
  3. Express:By DHL, FedEx, TNT, around 3-7days.
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